3M Anisotropic Conductive Film Product Selection Guide

 This slideshow is intended to help the customer choose the appropriate 3M™ Anisotropic Conductive Film (ACF) adhesive product for the job. The data included in this
graphic compare the important physical properties of the products. This product selection guide is to be used to look at  the variety of products available and decide on the proper ACF (or ACFs) to each application. In the end it's best to test the application using the particular AFC product. 3M provides a variety of high-performance anisotropic conductive film adhesive products used to mechanically and electrically connect flex circuits and other components to a variety of substrates. These reliable, technologies can replace soldering and mechanical fasteners in many applications, helping to hasten assembly time and lessen space requirements.

 

3M Anisotropic Conductive Film Selection Guide

3M™ Anisotropic Conductive Film Adhesives (ACF) are based on adhesive designs that are categorized into four product families. These categories include pressure sensitive adhesives (PSA), thermoplastic materials, thermoset materials, and a combination of a PSA and thermoset. The following graphics show these different product families and the grouping of products within each and showing a general comparison of performance ranking and process simplicity is added showing one level of trade-off necessary in the product selection process.

The following descriptions provide general, high-level, key product characteristics for
the individual 3M ACFs.

3M Film 5363 - Flex-to-Board (or -to-Flex) excellent reliability with polyimide flex, 200μm pitch, 200°C bond temperature, 10 sec bond cycle, high peel strength, max use temperature 125°C.

3M Film 7379 - Flex-to-Glass (or -to-Flex) Thermo-set low temperature cure. High adhesion to PET. Good thermal stability. 3M recommends that users consider testing 5363 for improved results.

3M Film 7303 - Flex-to-Board (or -to-Flex) ideal for polyester flex, 135°C bond temperature, 500μm pitch, stable interconnect resistance, max use temperature 80°C.

3M Film 7371 - Flex-to-Flex, Flex-to-Glass, Flex-to-PET.  Slight tack at room temperature. High adhesion to PET. Fast bond time.

3M Film 7371-20 - Flex-to-Flex, Flex-to-Glass, Flex-to-PET. Slight tack at room temperature. High adhesion to PET. Fast bond time. 20 micron particle size.

3M Film 7376-10 - Flex to Camera Module, Flex to Flex, Flex to PET. An acrylate-based adhesive system filled with 10 micron gold-coated polymer particles.

3M Film 7376-30 - Flex to Camera Module, Flex to Flex, Flex to PET. An acrylate-based adhesive system filled with 30 micron gold-coated polymer particles.

3M Film 9703/9705 - Flex-to-Board (or -to-Flex) PSA rapid bond, coarse pitch, max use temperature 70°C, (additional pressure support necessary for some applications).

  Application Bonding
Temperature
(°C)
Bonding
Time
(sec)
Bonding
Pressure
(MPa)
Particle
Diameter
(μ)
Adhesive
Thickness
(μ)
Pitch
Minimum
(μ)
Minimum
Pad Area
(sq mm)
Connection
Resistance
(mOhms)
90° Peel
Adhesion
(g/cm)
Temp/Humidity
Aging
(°C/%rh)
Temp
Cycling
(°C)
ACF 5363 Flex to Flex, Flex to PCB  190 - 210  10  3 - 5  10  40  200 0.15  <100  <700    
ACF 7371 Flex on Plastic/Glass 140 - 170 10 - 15 1-2 10 25 200 0.2 <100  <700  85/85  -40 to 85
ACF 7303  Flex to Flex, Flex to PCB 135 - 150 25 2 43 74 500 0.75  <200 <500    
ACF 7371-20 Touch panel 140 - 170 10 - 15 1-2 20 35 500 0.5 <20  <600  85/85  -40 to 85
ACF 7376-10 Camera module 140 - 160 7 - 15 1-2 10 40 200 0.1 <20  <900  85/85  -40 to 85
ACF 7376-30 Camera module 140 - 160 7 - 15 1-2 30 45 500 0.5 <20  <700  85/85  -40 to 85
ACF 7379 Glass 160 - 190 10 - 20 1-2 10 25 100 0.05 <3000  <700  85/85  -40 to 85
ACF 9703/9705 EMI/EMC Applications  15 - 70    0.10    50  800  3.2      60/95  -40 to 85

 

  Flex Type Connection Type
  Silver Ink on Polyester Gold/Copper on Polyester Gold/Copper on Polyimide Flex to Glass Flex to Plastic Device Flex to PCB Flex to Flex
ACF 5363     x     x x
ACF 7303 x x x   x x x
ACF 7371 x x x   x   x
ACF 7371-20 x x x   x   x
ACF 7376-10 x x x   x x x
ACF 7376-30 x x x   x x x
ACF 7379 x x x        
ACF 9703/9705       x   x x

 

acf-assembly
acf-bonding

Design requirements have been used in the development of these 3M™ Anisotropic Conductive Film Adhesive products. The products were developed for use in a wide range of applications. The following graphics and table offer some guidelines useful in choosing the correct product.

gap and pitch
 
 
 
variations in flex design

3M™ Anisotropic Conductive Film (ACF) 5363 is a electrically conductive, heat-bondable adhesive film. At room temperature the unbonded film is non-tacky and consists of a thermoset-thermoplastic adhesive matrix filled with conductive particles. These particles provide inter-connection of circuit lines through the adhesive thickness, but are spaced a certain distance apart for the product to be electrically insulating in the plane of the adhesive. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by trapping the conductive particles. The adhesive cures quickly at modest bonding temperature. The 3M ACF 5363 may be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.

 

Features and Benefits

  • Heat cure
  • Fast bond time
  • Thermo-set high temperature cure
  • Excellent chemical resistance
  • Highest thermal stability
  • Replaces solder for lead-free solution
  • Frozen storage

Product Attributes

Adhesive Thickness (metric) 40 micron
Adhesive Type Thermoset Epoxy
Application Electronic Component Bonding, Flex Bonding
Application Category Bonding
Bonding Method Thermo-compression bonding
Bonding Pressure 3 - 5 MPa
Bonding Temperature 190 - 210 degree C
Bonding Time 10 seconds
Conductive Particle Size 10 Micron
Conductive Particle Type Gold-coated Ni
Connection Type Flex to Flex, Flex to PCB
Flex Type Gold/Copper on Polyimide
Liner Thickness (metric) 50 micron
Liner Type Polyester Film with Silicone Release
Minimum Gap 4 mil
Minimum Gap (metric) 100 micron
Minimum Overlap Area 0.15 mm^2
Minimum Pitch 8 mil
Minimum Pitch (metric) 200 Micron
Product Form Roll
Product Series 5363
Shelf Life 4 Weeks
Shelf Life Frozen 15 Months
Standard Width (metric) 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm
Tacking Pressure 0.1 - 1.5 MPa
Tacking Temperature 90 - 110 degree C
Tacking Time 1 - 2 seconds
Total Trace Height (metric) 75 micron

3M™ Anisotropic Conductive Film (ACF) Adhesive 7303 is a electrically conductive, heat-bondable adhesive film. It is tacky at room temperature and is made of a thermosetting epoxy/acrylate adhesive matrix filled with conductive particles. These particles allow interconnection of circuit lines through the adhesive after bonding, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and bring the circuit pads into electrical contact by trapping the conductive particles. The thermoset quickly cures. ACF 7303 can be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.
 
Features and Benefits
  • Heat cure
  • Thermo-set low temperature cure
  • Tacky at room temperature
  • Good thermal stability
  • Reworkable
  • Frozen storage

Product Attributes

Adhesive Thickness (metric) 74 micron
Adhesive Type Epoxy/Acrylate Blend
Application Electronic Component Bonding, Flex Bonding
Application Category Bonding
Bonding Method Thermo-compression bonding
Bonding Pressure 2 MPa
Bonding Temperature 135 - 150 degree C
Bonding Time 25 seconds
Conductive Particle Size 43 Micron
Conductive Particle Type Silver-coated glass
Connection Type Flex to Flex, Flex to PCB
Flex Type Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric) 100 micron
Liner Type Polyester-coated Kraft with Silicone Release
Minimum Gap 10 mil
Minimum Gap (metric) 250 micron
Minimum Overlap Area 0.75 mm^2
Minimum Pitch 20 mil
Minimum Pitch (metric) 500 Micron
Product Form Roll
Product Series 7303
Shelf Life 9 Months
Shelf Life Frozen 18 Months
Standard Width (metric) 2.5 mm, 3.0 mm, 4.0 mm, 5.0 mm
Tacking Pressure 0.1 - 1.5 MPa
Tacking Temperature 25 degree C
Tacking Time 1 - 2 seconds
Total Trace Height (metric) 140 micron

3M™ Anisotropic Conductive Film (ACF) 7371 is a electrically conductive, heat-bondable adhesive film. The unbonded film is slightly tacky at room temperature and consists of a thermoset-elastomer and thermoplastic adhesive matrix filled with conductive particles. These particles provide interconnection of circuit lines through the adhesive, but are spaced so that the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to bring the circuit pads into contact by trapping the conductive particles. The adhesive rapidly cross-links at modest bonding temperature and pressure. 3M ACF 7371 is used in bonding a flexible printed circuit to another flexible printed circuit or to a plastic touch screen or plastic flat panel display device.
 
Features and Benefits
  • Heat cure
  • Fast bond time
  • Thermo-set low temperature cure
  • Slight tack at room temperature
  • High adhesion to PET
  • Good thermal stability
  • Reworkable
  • Frozen storage

Product Attributes

Adhesive Thickness (metric) 25 micron
Adhesive Type Acrylate-Based
Application Display Bonding, Touch Panel Bonding
Application Category Bonding
Bonding Method Thermo-compression bonding
Bonding Pressure 1 - 2 MPa
Bonding Temperature 140 - 170 degree C
Bonding Time 10 - 15 seconds
Conductive Particle Size 10 Micron
Conductive Particle Type Gold-coated polymer
Connection Type Flex to Flex, Flex to Glass, Flex to PET
Flex Type Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric) 50 micron
Liner Type Polyester Film with Silicone Release
Minimum Gap 4 mil
Minimum Gap (metric) 100 micron
Minimum Overlap Area 0.10 mm^2
Minimum Pitch 8 mil
Minimum Pitch (metric) 200 Micron
Product Form Roll
Product Series 7371
Shelf Life 4 Weeks
Shelf Life Frozen 12 Months
Standard Width (metric) 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm
Tacking Pressure 0.1 - 1.5 MPa
Tacking Temperature 60 - 90 degree C
Tacking Time 1 - 2 seconds
Total Trace Height (metric) 50 micron

3M™ Anisotropic Conductive Film (ACF) 7379 is a heat-bondable, electrically conductive adhesive film. The pre-bonded film is tacky at room temp and consists of a thermoset-elastomer and thermoplastic adhesive matrix loaded with conductive particles. These particles allow connection of circuit lines through the adhesive, but are spaced apart for the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to bring the circuit pads into contact by pinning the conductive particles. The adhesive cross-links rapidly at modest bonding temperature and pressure. The 3M ACF 7379 can be used in bonding a flexible printed circuit to glass-based devices such as displays or to another flexible printed circuit.
 
Features and Benefits
  • Heat cure
  • Thermo-set low temperature cure
  • Slight tack at room temperature
  • High adhesion to PET
  • Good thermal stability
  • Reworkable
  • Frozen storage

Product Attributes

Adhesive Thickness (metric) 25 micron
Adhesive Type Acrylate-Based
Application Display Bonding
Application Category Bonding
Bonding Method Thermo-compression bonding
Bonding Pressure 2 - 3 MPa
Bonding Temperature 160 - 190 degree C
Bonding Time 10 - 20 seconds
Conductive Particle Size 10 Micron
Conductive Particle Type Gold-coated polymer
Connection Type Flex to Glass
Flex Type Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric) 50 micron
Liner Type Polyester Film with Silicone Release
Minimum Gap 2 mil
Minimum Gap (metric) 50 micron
Minimum Overlap Area 0.05 mm^2
Minimum Pitch 4 mil
Minimum Pitch (metric) 100 Micron
Product Form Roll
Product Series 7379
Shelf Life 4 Weeks
Shelf Life Frozen 15 Months
Standard Width (metric) 1.5 mm, 2.0 mm, 3.0 mm
Tacking Pressure 0.1 - 1.5 MPa
Tacking Temperature 60 - 90 degree C
Tacking Time 1 - 2 seconds
Total Trace Height (metric) 50 micron

3M™ Electrically Conductive Adhesive Transfer Tape 9703 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is loaded with conductive particles which allow interconnection between circuits through the adhesive (the “Z-axis”) but are distanced enough apart for the product to be electrically insulating. 9703 ia easy to use in assembly operations. Tape 9703 electrically connects and bonds medium pitch flexible circuits with other flexible circuits (flex), rigid printed circuit boards (PCB) or LCD screens. 9703 offers great connection to common PCB substrates such as copper, gold, FR-4 epoxy, Kapton™ polyimide and polyester films. Stable electrical performance in any flexible circuit interconnection application may require mechanical reinforcement (clamping). Tape 9703 also electrically connects and mechanically bonds EMI/RFI shield and gaskets to metal frames and enclosures. The low contact resistance and tape construction result in good EMI performance. Tape 9703 can be applied as die cut parts or in roll form and has good adhesion to common EMI/RFI substrates such as aluminum, stainless steel, and smooth gasket materials.
 
Features and Benefits
  • Low outgassing acrylic adhesive
  • Anisotropic Z-axis electrical conductivity
  • PSA tack properties
  • Thermal curing not required
  • Easy to use in assembly operations
  • Can be applied as die-cut parts or in roll form

Product Attributes

Adhesive Thickness (metric) 50 micron
Adhesive Type Conductive Acrylic
Application Antenna Bonding (with Grounding), EMI Shielding (with Grounding), Flex Bonding, Flex Bonding (with Grounding), Flex Stiffener Bonding (with Grounding), Grounding, Metal to Metal Bonding (with Grounding), Static Dissipation
Application Category Bonding, EMI/EMC Applications
Bonding Method Finger pressure or roller bar
Bonding Pressure 0.10 MPa
Bonding Temperature 15 - 70 Degree C
Conductive Particle Type Silver-coated nickel
Conductivity Direction Z-Axis Conductive
Conductivity Filler Type Particle
Connection Type Flex to Flex, Flex to LCD, Flex to PCB
Length 108 yd, 36 yd
Liner Thickness (metric) 100 micron
Liner Type Silicone Treated Polycoated Kraft Paper (PCK)
Minimum Gap 15 mil
Minimum Gap (metric) 400 micron
Minimum Overlap Area 3.2 mm^2
Minimum Pitch 32 mil
Minimum Pitch (metric) 800 Micron
Product Form Roll
Product Series 9703
Shelf Life 24 Months @ 21 Degree C and 50% RH
Total Tape Thickness without Liner 2.0 mil
Total Tape Thickness without Liner (metric) 0.05 mm

3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) 9705 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is loaded with conductive particles which provide connection between conductive materials through the adhesive(the “Z-axis”) but are distanced apart for the product to be electrically insulating in the plane of the adhesive. Tape 9705 electrically connects and adhesively bonds medium pitch flexible circuits with other flexible circuits (flex),
rigid printed circuit boards (PCB) or LCD screens. Stable electrical performance in any flexible circuit
interconnection application may require added mechanical reinforcement (clamping or compressing) in the bond area.
The PSA tack properties and lack of any thermal curing make Tape 9705 easy to use in assembly operations. Tape 9705 offers good adhesion to common PCB substrates such as
copper, gold, FR-4 epoxy, Kapton™ polyimide and polyester films.
Tape 9705 can be applied as die cut parts or in
roll form and has good adhesion to common EMI/RFI substrates such as copper, stainless steel, and smooth gasket materials.
Tape 9705 also electrically connects and adhesively bonds EMI/RFI shield and gaskets to metal frames and enclosures. The
low contact resistance and tape construction result in good EMI performance.
 
Features and Benefits
  • Standard outgassing version of Tape 9703
  • Standard adhesion acrylic adhesive
  • Anisotropic Z-axis electrical conductivity
  • PSA tack properties
  • Thermal curing not required
  • Can be applied as die-cut parts or in roll form
  • Easy to use in assembly operations

 

Product Attributes

Adhesive Thickness (metric) 50 micron
Adhesive Type Conductive Acrylic
Application Antenna Bonding (with Grounding), EMI Shielding (with Grounding), Flex Bonding, Flex Bonding (with Grounding), Flex Stiffener Bonding (with Grounding), Grounding, Metal to Metal Bonding (with Grounding), Static Dissipation
Application Category Bonding, EMI/EMC Applications
Bonding Method Finger pressure or roller bar
Bonding Pressure 0.03 - 0.10 MPa
Bonding Temperature 20 - 35 Degree C
Conductive Particle Type Silver-coated filler
Conductivity Direction Z-Axis Conductive
Conductivity Filler Type Particle
Connection Type Flex to Flex, Flex to LCD, Flex to PCB
Length 108 yd, 36 yd
Liner Thickness (metric) 100 micron
Liner Type Silicone Treated Polycoated Kraft Paper (PCK)
Minimum Gap 15 mil
Minimum Gap (metric) 400 micron
Minimum Overlap Area 3.2 mm^2
Minimum Pitch 32 mil
Minimum Pitch (metric) 800 Micron
Product Form Roll
Product Series 9705
Shelf Life 24 Months @ 21 Degree C and 50% RH
Total Tape Thickness without Liner 2.0 mil
Total Tape Thickness without Liner (metric) 0.05 mm

3M™ Anisotropic Conductive Film (ACF) 7376-30 is a electrically conductive, heat-bondable adhesive film.The unbonded film is slightly tacky at room temperature and is made of a thermoset-thermoplastic adhesive matrix filled with conductive particles.These particles provide connection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to connect the circuit pads by pinning the conductive particles. The adhesive sets rapidly at modest bonding temperature and pressure. The 3M ACF 7376-30 is used to bond a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.
 
Features and Benefits
  • Heat cure
  • Fast bond time
  • Thermo-set low temperature cure
  • Slight tack at room temperature
  • 30 micron particle size
  • High adhesion to PET
  • Good thermal stability
  • Reworkable
  • Frozen storage

Product Attributes

Adhesive Thickness (metric) 45 micron
Adhesive Type Acrylate-Based
Application Camera Module Assembly
Application Category Bonding
Bonding Method Thermo-compression bonding
Bonding Pressure 1 - 2 MPa
Bonding Temperature 140 - 160 degree C
Bonding Time 7 - 15 seconds
Conductive Particle Size 30 Micron
Conductive Particle Type Gold-coated polymer
Connection Type Flex to Camera Module, Flex to Flex, Flex to PET
Flex Type Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric) 50 micron
Liner Type Polyester Film with Silicone Release
Minimum Gap 4 mil
Minimum Gap (metric) 100 micron
Minimum Overlap Area 0.50 mm^2
Product Form Roll
Product Series 7376-30
Shelf Life 4 Weeks
Shelf Life Frozen 12 Months
Standard Width (metric) 2.0 mm, 5.0 mm, 6.5 mm
Tacking Pressure 0.1 - 1.5 MPa
Tacking Temperature 60 - 90 degree C
Tacking Time 1 - 2 seconds
Total Trace Height (metric) 75 micron

3M™ Anisotropic Conductive Film (ACF) 7376-10 is a electrically conductive, heat-bondable adhesive film. The unbonded film is sticky at room temperature and is made of of a thermoset-elastomer and thermoplastic adhesive matrix packed with conductive particles. These particles allow interconnection of circuits through the adhesive, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by pinning the conductive particles.The adhesive cross-links quickly at modest bonding temperature and pressure. The 3M ACF 7376-10 is used in bonding a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.
 
Features and Benefits
  • Heat cure
  • Fast bond time
  • Thermo-set low temperature cure
  • Slight tack at room temperature
  • High adhesion to PET
  • Good thermal stability
  • Reworkable
  • Frozen storage

Product Attributes

Adhesive Thickness (metric) 40 micron
Adhesive Type Acrylate-Based
Application Camera Module Assembly
Application Category Bonding
Bonding Method Thermo-compression bonding
Bonding Pressure 1 - 2 MPa
Bonding Temperature 140 - 160 degree C
Bonding Time 7 - 15 seconds
Conductive Particle Size 10 Micron
Conductive Particle Type Gold-coated polymer
Connection Type Flex to Camera Module, Flex to Flex, Flex to PET
Flex Type Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric) 50 micron
Liner Type Polyester Film with Silicone Release
Minimum Gap 2.5 mil
Minimum Gap (metric) 70 micron
Minimum Overlap Area 0.10 mm^2
Product Form Roll
Product Series 7376-10
Shelf Life 4 Weeks
Shelf Life Frozen 12 Months
Standard Width (metric) 1.5 mm, 2.0 mm, 5.5 mm, 6.5 mm, 8.0 mm
Tacking Pressure 0.1 - 1.5 MPa
Tacking Temperature 60 - 90 degree C
Tacking Time 1 - 2 seconds
Total Trace Height (metric) 75 micron

3M™ Anisotropic Conductive Film (ACF) 7371-20 is a electrically conductive, heat-bondable adhesive film. It is has tack at room temperature and consists of a thermoset-thermoplastic adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuits through the adhesive, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by trapping the conductive particles. The adhesive cures fast at modest bonding temperature and pressure. The 3M ACF 7371-20 is used in bonding a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices. 
 
Features and Benefits
  • Heat cure
  • Fast bond time
  • Thermo-set low temperature cure
  • Slight tack at room temperature
  • 20 micron particle size
  • High adhesion to PET
  • Good thermal stability
  • Reworkable
  • Frozen storage

Product Attributes

Adhesive Thickness (metric) 35 micron
Adhesive Type Acrylate-Based
Application Touch Panel Bonding
Application Category Bonding
Bonding Method Thermo-compression bonding
Bonding Pressure 1 - 2 MPa
Bonding Temperature 140 - 160 degree C
Bonding Time 10 - 15 seconds
Conductive Particle Size 20 Micron
Conductive Particle Type Gold-coated polymer
Connection Type Flex to Flex, Flex to Glass, Flex to PET
Flex Type Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric) 50 micron
Liner Type Polyester Film with Silicone Release
Minimum Gap 4 mil
Minimum Gap (metric) 100 micron
Minimum Overlap Area 0.50 mm^2
Minimum Pitch 8 mil
Minimum Pitch (metric) 200 Micron
Product Form Roll
Product Series 7371-20
Shelf Life 4 Weeks
Shelf Life Frozen 12 Months
Standard Width (metric) 1.0 mm, 1.5 mm, 2.0 mm, 3.0 mm
Tacking Pressure 0.1 - 1.5 MPa
Tacking Temperature 60 - 90 degree C
Tacking Time 1 - 2 seconds
Total Trace Height (metric) 70 micron